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Investigation of cooling capability of ceramic substrates for power electronics applications

Jiří Hlína, Jan Řeboun, Martin Janda

2024Applied Thermal Engineering22 citationsDOI

Topics & Concepts

Materials scienceCeramicSubstrate (aquarium)ElectronicsElectronics coolingStack (abstract data type)Computer coolingWater coolingPower electronicsActive coolingThermal management of electronic devices and systemsDissipationOptoelectronicsPower (physics)Mechanical engineeringPower moduleThermalComposite materialElectrical engineeringComputer scienceEngineeringThermodynamicsProgramming languagePhysicsGeologyOceanographyHeat Transfer and OptimizationSilicon Carbide Semiconductor TechnologiesThermal properties of materials
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