Insights into abnormal grain growth in copper thin films for reduced electrical resistivity: A quantitative multi-order-parameter phase-field study under finite element framework
Wei Peng, Jianbao Gao, Tiwen Lu, Binhan Sun, Xiancheng Zhang, Lijun Zhang, S.T. Tu
Topics & Concepts
Materials scienceElectrical resistivity and conductivityCopperThin filmMicrostructureMicroelectronicsGrain boundaryGrain growthAnisotropyPhase (matter)Grain sizeCondensed matter physicsMetallurgyComposite materialNanotechnologyOpticsElectrical engineeringChemistryPhysicsOrganic chemistryEngineeringCopper Interconnects and ReliabilityAluminum Alloy Microstructure PropertiesAluminum Alloys Composites Properties