Fabrication of high-strength Cu–Cu joint by low-temperature sintering micron–nano Cu composite paste

Yang Peng, Yun Mou, Jiaxin Liu, Mingxiang Chen

2020Journal of Materials Science Materials in Electronics53 citationsDOI

Topics & Concepts

Materials scienceSinteringComposite numberShear strength (soil)MicrostructureComposite materialPorosityFabricationNano-Joint (building)CopperLayer (electronics)MetallurgySoil scienceMedicineArchitectural engineeringSoil waterAlternative medicinePathologyEnvironmental scienceEngineeringElectronic Packaging and Soldering Technologies3D IC and TSV technologiesNanomaterials and Printing Technologies