Thermal stability of immiscible Cu-Ag/Fe triphase multilayers with triple junctions
Tongjun Niu, Yifan Zhang, Jaehun Cho, Jin Li, Haiyan Wang, X. Zhang
Topics & Concepts
Materials scienceThermal stabilityMicrostructureLayer (electronics)Grain boundaryThermalMetalKineticsComposite materialChemical engineeringMetallurgyThermodynamicsEngineeringPhysicsQuantum mechanicsAluminum Alloys Composites PropertiesMicrostructure and mechanical propertiesnanoparticles nucleation surface interactions