Characteristics of Thermosetting Polymer Nanocomposites: Siloxane-Imide-Containing Benzoxazine with Silsesquioxane Epoxy Resins
Chih-Hao Lin, Wen-Bin Chen, Wha-Tzong Whang, Chun‐Hua Chen
Abstract
A series of innovative thermosetting polymer nanocomposites comprising of polysiloxane-imide-containing benzoxazine (PSiBZ) as the matrix and double-decker silsesquioxane (DDSQ) epoxy or polyhedral oligomeric silsesquioxane (POSS) epoxy were prepared for improving thermosetting performance. Thermomechanical and dynamic mechanical characterizations indicated that both DDSQ and POSS could effectively lower the coefficient of thermal expansion by up to approximately 34% and considerably increase the storage modulus (up to 183%). Therefore, DDSQ and POSS are promising materials for low-stress encapsulation for electronic packaging applications.
Topics & Concepts
SilsesquioxaneThermosetting polymerEpoxyMaterials scienceSiloxaneNanocompositeImideComposite materialPolymerDynamic mechanical analysisPolymer chemistrySilicone and Siloxane ChemistrySynthesis and properties of polymersEpoxy Resin Curing Processes