High Density Integration Technologies for SiPh Based Optical I/Os
Karl Muth, Vivek Raghuraman, Sukeshwar Kannan, Hari Potluri
Abstract
This paper shows the necessary technologies for SiPh based optical I/Os merging mature silicon chiplet packaging and fiber connectivity to achieve the highest I/O efficiency (highest density, lowest power and cost). An early Broadcom CPO (co-packaged-optics) prototype system is demonstrated, and main performance parameters are reported.
Topics & Concepts
SiliconOptical fiberOptoelectronicsMaterials sciencePower (physics)Integrated opticsComputer sciencePhysicsTelecommunicationsQuantum mechanicsPhotonic and Optical DevicesSemiconductor Lasers and Optical DevicesSemiconductor Quantum Structures and Devices