Enhanced thermal conductivity of epoxy acrylate/<scp>h‐BN</scp> and <scp>AlN</scp> composites by photo‐curing <scp>3D</scp> printing technology
Yucong Lin, Weijian Deng, Yueyue Rui, Yun Liu, Gang Lu, Jie Liu
Abstract
Abstract Filling hexagonal boron nitride (h‐BN) is a hot topic in the research of improving the thermal conductivity of polymer composites. Conversely, its difficulty in dispersing and forming a three‐dimensional thermal network has become a major problem. This article uses liquid resin can effectively help the filler to be evenly dispersed and construct a multi‐layer connection network through 3D printing technology, which improves the thermal conductivity of polymer effectively. With the addition of 30 wt% h‐BN, the thermal conductivity of the epoxy acrylate (EA) composite reaches 1.60 Wm −1 K −1 , which is 6.8 times that of pure epoxy acrylic resin. Our work provides a new idea for improving the thermal conductivity of photocured polymers.