A novel PEG/PMMA based binder composition for void-free metal injection moulding of Ti components
Muhammad Dilawer Hayat, Hongzhou Zhang, Kariappa Maletira Karumbaiah, Harshpreet Singh, Ying Xu, Liming Zou, Xuanhui Qu, Sudip Ray, Peng Cao
Topics & Concepts
Materials scienceDifferential scanning calorimetryPolyvinyl acetateThermogravimetric analysisComposite materialPolyethylene glycolRheologyUltimate tensile strengthFourier transform infrared spectroscopyRheometryCrystallizationPEG ratioChemical engineeringPolymerPhysicsFinanceEngineeringThermodynamicsEconomicsInjection Molding Process and PropertiesAdvanced materials and compositesPowder Metallurgy Techniques and Materials