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Towards understanding the mechanisms of material removal and deformation in GaAs during nanomilling

Jiqiang Wang, Yongda Yan, Hailong Cui, Shaoqin Liu, Chen Li, Yanquan Geng

2025Journal of Materials Processing Technology55 citationsDOI

Topics & Concepts

Materials scienceDeformation (meteorology)Composite materialMetallurgyAdvanced Surface Polishing TechniquesMetal and Thin Film MechanicsIntegrated Circuits and Semiconductor Failure Analysis
Towards understanding the mechanisms of material removal and deformation in GaAs during nanomilling | Litcius