Litcius/Paper detail

Cu Protrusion of Different through-Silicon via Shapes under Annealing Process

Alireza Eslami Majd, Il Ho Jeong, Jae Pil Jung, N.N. Ekere

2021Journal of Materials Engineering and Performance23 citationsDOI

Topics & Concepts

Materials scienceThrough-silicon viaInterconnectionFabricationWaferReliability (semiconductor)Annealing (glass)Three-dimensional integrated circuitOptoelectronicsComputer scienceIntegrated circuitComposite materialQuantum mechanicsPower (physics)MedicineAlternative medicinePathologyPhysicsComputer network3D IC and TSV technologiesElectronic Packaging and Soldering TechnologiesAdvanced Surface Polishing Techniques
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