Solid State Diffusion Bonding Process-A Review
T. Aravinda, H. B. Niranjan, B. Satish Babu, M. Udaya Ravi
Abstract
Abstract The present paper reports on the various diffusion bonding techniques using atomic diffusion of elements at the interface. The bonding process is used mainly for joining dissimilar metals. However, two similar metals can also be bonded with or without using an interlayer. Dissimilar materials include metalceramic; interlayer can also be used if necessary, in between the interfaces. The other methods of joining would probably interfere with the microstructure of the base metal at the point of interface. Various methods of joining like welding create reaction between the materials in the molten pool. Residual stresses would not appear at the bonding site, neither has it created thermal gradients using diffusion technique. Distortion observed in diffusion bonding is quite less compared to other joining process. It is also observed that the interface retains similar mechanical and physical properties as that of the base material. The strength at the interface depends on parameters like temperature, pressure and time taken for contact while forming the solid state bond.