Litcius/Paper detail

DrGaN: an Integrated CMOS Driver-GaN Power Switch Technology on 300mm GaN-on-Si with E-mode GaN MOSHEMT and 3D Monolithic Si PMOS

Han Wui Then, M. Radosavljević, Samuel James Bader, Ahmad Zubair, Heli Vora, N. Nair, Pratik Koirala, Michael Beumer, P. Nordeen, A. Vyatskikh, T. Hoff, J. Peck, R. Nahm, Thoe K. Michaelos, Emmanuel Khora, R. Jordan, C. R. Hoffman, Noel Franco, A. Oni, S. Beach, D Garg, Dimitri Frolov, Alvaro D. Latorre-Rey, A. Mitaenko, Jag Rangaswamy, Soumen Sarkar, Sally Ahmed, V. Rayappa, Hsien‐Chin Chiu, A. Hubert, S. Brophy, N. Arefm, Nachiket Desai, Harish K. Krishnamurthy, Jian Yu, K. Ravichandran, P. Fischer

202318 citationsDOI

Abstract

We demonstrate industry’s first CMOS "DrGaN" technology fabricated in a 300mm GaN-on-Silicon process combining enhancement-mode high-k dielectric GaN MOSHEMT with integrated 3D monolithic Si PMOS by layer transfer. The 180nm DrGaN with power transistor width of 421.1mm achieves an excellent R <inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">ON</inf> = ImΩ (R <inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">DSON</inf> =0.8 mfl-mm <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">2</sup> ) and drain leakage well below 0.1mA. In this work, we demonstrate a truly gate-last 3D monolithic integration process, where the high temperature activation steps for the Si PMOS transistors are completed before the gate dielectric of the GaN MOSHEMT transistors is deposited. This resolves one major hurdle in the 3D monolithic integration of GaN and Si CMOS transistors. Moreover, in this new process, the GaN and Si CMOS transistors share the same backend interconnect stack for reduced mask count and no additional intra-connects. The best FOM=1/(R <inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">ON</inf> Q <inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">GG</inf> ) of 0.59 (mΩ-nC) <sup xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">-1</sup> is achieved for a L <inf xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">G</inf> 30nm GaN MOSHEMT.

Topics & Concepts

PMOS logicCMOSGallium nitrideOptoelectronicsMaterials scienceMode (computer interface)Power (physics)Wide-bandgap semiconductorElectrical engineeringTransistorComputer scienceVoltageEngineeringNanotechnologyPhysicsLayer (electronics)Quantum mechanicsOperating systemGaN-based semiconductor devices and materialsSilicon Carbide Semiconductor TechnologiesRadio Frequency Integrated Circuit Design