The Heat-Dissipation Sintered Interface of Power Chip and Heat Sink and Its High-Temperature Thermal Analysis
Guanda Qu, Zhongyang Deng, Wei Guo, Zilong Peng, Qiang Jia, Erping Deng, Hongqiang Zhang
Abstract
A kind of interface between power chip and heat sink with high interfacial strength and high thermal conductivity was sintered by different Ag particles in this article. The results showed that the maximum shear strength of the sintered chip joint was 49 MPa and more than the value required by the MIL-STD-883J standard. With the increasing of sintering temperature and pressure, the room temperature thermal conductivity of the Ag sintered layer increased to 265.52 <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$\text{W}\cdot \text{m}^{-1}\cdot \text{K}^{-1}$ </tex-math></inline-formula> under the combined effects of twin, grain size, porosity, and dislocation density. The thermal conductivity of Ag sintering layer was four times that of tin-lead sintering layer and eight times that of Au-based bonding layer. Meanwhile, the Ag sintered layer had favorable heat dissipation performance at different operating temperatures, which had the potential to be used as the connection interface between power chip and heat sink.