Litcius/Paper detail

Polishing pad for reducing edge roll-off while maintaining good global flatness of silicon wafer

Urara Satake, Senju Matsui, Toshiyuki Enomoto

2020Precision Engineering13 citationsDOI

Topics & Concepts

PolishingWaferFlatness (cosmology)Materials scienceChemical-mechanical planarizationEnhanced Data Rates for GSM EvolutionOptoelectronicsComposite materialComputer sciencePhysicsQuantum mechanicsCosmologyTelecommunicationsAdvanced Surface Polishing TechniquesDiamond and Carbon-based Materials ResearchIntegrated Circuits and Semiconductor Failure Analysis
Polishing pad for reducing edge roll-off while maintaining good global flatness of silicon wafer | Litcius