Litcius/Paper detail

Compressible thermal interface materials with high through-plane thermal conductivity from vertically oriented carbon fibers

Liqin Fu, Nizao Kong, Min Huang, Yexin Tian, Yuanwei Yan, Bingjie Wen, Chong Ye, Dong Huang, Fei Han

2024Journal of Alloys and Compounds26 citationsDOI

Topics & Concepts

Thermal conductivityMaterials scienceThermalInterface (matter)Composite materialCompressibilityThermal greaseChemical engineeringThermodynamicsPhysicsEngineeringCapillary numberCapillary actionThermal properties of materialsComposite Material MechanicsTribology and Wear Analysis