Enhancing mechanical properties via the dual effect of Ni addition and temperature gradient for 5 μm Cu/Sn-3.0Ag-0.5Cu/Cu transient liquid phase bonding
Chen-Sung Chao, Zih-You Wu, Yin-Ku Lee, Pin-Wei Huang, Shou-Yi Chang, Su-Yueh Tsai, Jenq‐Gong Duh
Topics & Concepts
IntermetallicMaterials scienceMicrostructureSolderingMetallurgyShear strength (soil)Substrate (aquarium)Grain sizeDissolutionPhase (matter)Grain boundaryDirect shear testComposite materialShear (geology)AlloyChemical engineeringOceanographyGeologySoil scienceOrganic chemistryChemistrySoil waterEngineeringEnvironmental scienceElectronic Packaging and Soldering Technologies3D IC and TSV technologiesIntermetallics and Advanced Alloy Properties