Manufacturing profile-free copper foil using laser shock flattening
Haifeng Yang, Fei Xiong, Wang Yan, Jia Le, Liu Hao, Hao Jingbin
Topics & Concepts
Materials scienceCopperFOIL methodComposite materialPrinted circuit boardCopper platingSurface roughnessMetallurgyElectrical engineeringLayer (electronics)EngineeringElectroplatingSurface Treatment and Residual StressMetal and Thin Film MechanicsLaser Material Processing Techniques