Near-junction microfluidic cooling for GaN HEMT with capped diamond heat spreader
Hang Zhang, Zhixiong Guo
Topics & Concepts
Materials scienceMicrochannelJunction temperatureHeat fluxThermal resistanceDiamondLaminar flowOptoelectronicsHeat sinkHigh-electron-mobility transistorHeat spreaderHeat transferThermalComposite materialMechanicsTransistorThermodynamicsNanotechnologyElectrical engineeringPhysicsEngineeringVoltageHeat Transfer and OptimizationSilicon Carbide Semiconductor TechnologiesThermal properties of materials