Litcius/Paper detail

High-Efficiency GaN/SiC Doubler Terahertz Monolithic Integrated Circuit at 175 GHz

Lisen Zhang, Guodong Gu, Shixiong Liang, Yuanjie Lv, Xubo Song, Peng Xu, Xiaolin Hao, Aimin Bu, Zhihong Feng

2023IEEE Electron Device Letters17 citationsDOI

Abstract

A high-power, high-efficiency, 175 GHz frequency doubler terahertz monolithic integrated circuit (TMIC) in continuous wave (CW) mode has been fabricated using planar gallium nitride (GaN) Schottky barrier diodes (SBDs) on a SiC substrate. Heat dissipation is improved by adopting a high thermal conductivity SiC substrate. At room temperature, the GaN doubler has an output power exceeding 110 mW at 164 GHz to 181 GHz with an efficiency of 11 % to 20.6 % in CW mode. A 242 mW maximum output power with 20.2 % efficiency is obtained at 175 GHz. The results imply that a GaN-based monolithic integrated frequency doubler provides a viable means of obtaining high output power and high efficiency in CW mode.

Topics & Concepts

Materials scienceOptoelectronicsSchottky diodeFrequency multiplierGallium nitrideTerahertz radiationWide-bandgap semiconductorIntegrated circuitSubstrate (aquarium)Energy conversion efficiencyThermal conductivityDiodeElectrical engineeringCMOSEngineeringNanotechnologyOceanographyComposite materialLayer (electronics)GeologyGaN-based semiconductor devices and materialsSuperconducting and THz Device TechnologyMicrowave Engineering and Waveguides