Reliability Study of Critical Structural Redistribution Layers in Advanced Packaging: A Review
Jiajie Jin, Peisheng Liu, Yaohui Deng, Zhao Zhang
Topics & Concepts
Reliability engineeringReliability (semiconductor)Redistribution (election)Reliability theoryStructural reliabilityElectronic packagingMaterials scienceComputer scienceEngineeringForensic engineeringElectronic engineeringFailure rateProbabilistic logicThermodynamicsLawPower (physics)PoliticsPhysicsArtificial intelligencePolitical scienceElectronic Packaging and Soldering TechnologiesMaterial Properties and ProcessingCopper Interconnects and Reliability