Numerical and experimental study on cooling high power chips of data centers using double-side cooling module based on mini-channel heat sink
Deng Zeng, Shunlu Zhang, Kefan Ma, Chunbo Jia, Yanqiang Sun, Xu Chen, Yufeng Luo, Baofeng Li, Tiejun Li
Topics & Concepts
Heat sinkCoolantHeat transferMaterials scienceAir coolingComputer coolingChipNuclear engineeringWater coolingMechanical engineeringMechanicsElectrical engineeringEngineeringThermal management of electronic devices and systemsPhysicsHeat Transfer and OptimizationHeat Transfer and Boiling StudiesSilicon Carbide Semiconductor Technologies