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Underfill material property dependence of lifetime and mechanical behavior of BGA package: EBSD and FEM investigations

Dajung Kim, Dajung Kim, Jiyeon Park, Jeongki Jang, Hyun-Seung Yang, Kwangho Kim, Chulmin Oh, Dongjin Kim, Dongjin Kim

2023Microelectronics Reliability14 citationsDOI

Topics & Concepts

Ball grid arrayFlip chipMaterials scienceComposite materialSolderingReliability (semiconductor)Finite element methodStructural engineeringLayer (electronics)EngineeringThermodynamicsPhysicsAdhesivePower (physics)Electronic Packaging and Soldering Technologies3D IC and TSV technologiesElectromagnetic Compatibility and Noise Suppression
Underfill material property dependence of lifetime and mechanical behavior of BGA package: EBSD and FEM investigations | Litcius