On the optimization of molding warpage for wafer-level glass interposer packaging

Shuchao Bao, Wei Li, Yimin He, Yi Zhong, Long Zhang, Daquan Yu

2023Journal of Materials Science Materials in Electronics12 citationsDOI

Topics & Concepts

InterposerMaterials scienceMolding (decorative)WaferElectronic packagingComposite materialFinite element methodReliability (semiconductor)Wafer-level packagingThermal expansionMechanical engineeringOptoelectronicsStructural engineeringEngineeringPower (physics)Etching (microfabrication)Layer (electronics)Quantum mechanicsPhysics3D IC and TSV technologiesNanofabrication and Lithography TechniquesAdditive Manufacturing and 3D Printing Technologies