Constituents and performance of no-clean flux for electronic solder
Saif Wakeel, A.S.M.A. Haseeb, M. Afifi, Sedat Bingöl, Khoo Ly Hoon
Topics & Concepts
SolderingCuring (chemistry)Flip chipMaterials scienceComposite materialSolubilityChemical engineeringChemistryOrganic chemistryAdhesiveLayer (electronics)EngineeringElectronic Packaging and Soldering TechnologiesAdvanced Sensor Technologies ResearchThermal and Kinetic Analysis