Litcius/Paper detail

A High RF-Performance AlGaN/GaN HEMT With Ultrathin Barrier and Stressor <i>In Situ</i> SiN

Sheng Wu, Minhan Mi, Meng Zhang, Ling Yang, Bin Hou, Xiaohua Ma, Yue Hao

2021IEEE Transactions on Electron Devices28 citationsDOI

Abstract

The submicrometer gate HEMT is fabricated with an ultrathin-barrier (UTB) AlGaN/gallium nitride (GaN) combined with <italic xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">in situ</i> SiN passivation. The sheet resistance of the UTB Al <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">0.2</sub> Ga <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">0.8</sub> N (4 nm)/GaN heterostructure is effectively reduced by the SiN <sub xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">x</sub> passivation layer grown by metal organic chemical vapor deposition (MOCVD), from 6500 to <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">$312~ \Omega $ </tex-math></inline-formula> /⬜. With the 20-nm stress-engineered <italic xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">in situ</i> SiN, the device not only provides a large output current of 1.05 A/mm but also demonstrates promising potential on the RF applications, which gives AlGaN material two records high cutoff frequency <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">${f} _{\text {T}}/{f} _{\text {max}}$ </tex-math></inline-formula> of 157 GHz/334 GHz for 100-nm gated device and 211 GHz/379 GHz for 70-nm gated device. During the continuous wave (CW) power measurement at 30 GHz, the 70-nm devices exhibit a large output power of 4.6 W/mm associated with a peak power-added efficiency (PAE) of 48.1% and a gain of 11.6 dB ( <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">${V} _{\text {ds}} =20$ </tex-math></inline-formula> V), and a high PAE of 53.8% with an output power density of 1.9 W/mm and a gain of 10.8 dB ( <inline-formula xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink"> <tex-math notation="LaTeX">${V} _{\text {ds}} =10$ </tex-math></inline-formula> V), respectively. The huge potential of the UTB-AlGaN/GaN is demonstrated for high-frequency and large-output power applications when it is combined with the <italic xmlns:mml="http://www.w3.org/1998/Math/MathML" xmlns:xlink="http://www.w3.org/1999/xlink">in situ</i> SiN, which is necessary for future communication systems.

Topics & Concepts

High-electron-mobility transistorPassivationMaterials sciencePhysicsOptoelectronicsNanotechnologyLayer (electronics)TransistorQuantum mechanicsVoltageGaN-based semiconductor devices and materialsGa2O3 and related materialsMetal and Thin Film Mechanics