Research Progress on Sintered Micro-silver Paste for Power Electronic Packaging
Mulan Li, Shijun Huang, Zifeng Ding, Cai‐Fu Li
Topics & Concepts
Electronic packagingSolid-state physicsMaterials scienceSinteringElectronic materialsMetallurgyNanotechnologyEngineering physicsComposite materialEngineeringPhysicsCondensed matter physicsElectronic Packaging and Soldering Technologies3D IC and TSV technologiesElectrodeposition and Electroless Coatings