Development of polystyrene/polyaniline/ceria (PS/PANI/CeO2) multi-component abrasives for photochemical mechanical polishing/planarization applications
Ailian Chen, Tianyu Wang, Yue Chen, Shirui Wang, Yang Chen
Topics & Concepts
Chemical-mechanical planarizationMaterials sciencePolyanilinePolystyreneChemical engineeringScanning electron microscopePolishingLayer (electronics)PolymerThermogravimetric analysisConductive polymerComposite materialPolymerizationEngineeringAdvanced Surface Polishing TechniquesDiamond and Carbon-based Materials ResearchForce Microscopy Techniques and Applications