Influence mechanism of solder aging and thermal network model optimization of multi-chip IGBT modules
Haoyang Cui, Mengfan Zhou, Yang Cheng, Jiawen Li, Chong Wang
Topics & Concepts
Insulated-gate bipolar transistorJunction temperatureThermal resistanceChipMaterials scienceElectronic engineeringThermal conductionFlip chipThermalElectrical engineeringMechanical engineeringEngineeringVoltageLayer (electronics)Composite materialAdhesivePhysicsMeteorologySilicon Carbide Semiconductor TechnologiesElectromagnetic Compatibility and Noise SuppressionInduction Heating and Inverter Technology