Mechanical simulation of foldable organic light‐emitting diode display supporting layer
Wenqiang Wang, Yongzhen Jia, Haoqun Li, Maoyuan Jiang, Zhuo Zhang
Abstract
Abstract The bending reliability is the key characteristic of foldable organic light‐emitting diode (OLED) panel. In the bending process of foldable OLED panel module, display supporting layer crack and optically clear adhesive (OCA) layer peeling issue often occur. In this study, a periodic pattern supporting layer is designed to solve the peeling and crack issue. The finite element method for simulating the foldable panel was constructed to investigate the correlation between the dimensions of the periodic pattern substructure and the crack stress. The results show that the periodic pattern substructure can decrease the modulus of the bending zone, which can significantly improve the flexibility of the supporting layer. It makes the deformations of OCA to be coordinated during the bending process, thus effectively reducing the peeling issue. In addition, the crack stress values of the periodic pattern substructure directly rely on its dimensions. It indicates that a proper design of the pattern substructure and feature dimensions is important to improve the bending reliability of the OLED panel.