Adhesion mechanism between mold resin and sputtered copper for electromagnetic wave shield packages
Soichi Homma, Masaya Shima, Yuusuke Takano, Takeshi Watanabe, Kazuhiro Murakami, Masatoshi Fukuda, Takashi Imoto, Hiroshi Nishikawa
Topics & Concepts
AdhesionSputteringMaterials scienceMoldElectromagnetic shieldingComposite materialSurface roughnessCopperSurface finishEtching (microfabrication)Thin filmLayer (electronics)NanotechnologyMetallurgyElectronic Packaging and Soldering TechnologiesElectromagnetic wave absorption materialsElectrical Contact Performance and Analysis