Electrical and mechanical reliability and failure mechanism analysis of electrically conductive adhesives
Weiwei Zhang, Zhijun Yao, Hao Liu, Jiahao Liu, Mingyu Li, Fuquan Li, Hongtao Chen
Topics & Concepts
Materials scienceReliability (semiconductor)Thermal shockComposite materialInterconnectionAdhesiveElectrical conductorFailure mechanismFracture (geology)MicrostructureReliability engineeringComputer scienceEngineeringComputer networkLayer (electronics)Quantum mechanicsPhysicsPower (physics)Electronic Packaging and Soldering Technologies3D IC and TSV technologiesIntegrated Circuits and Semiconductor Failure Analysis