Arbitrary-shape-adaptable strain sensor array with optimized circuit layout via direct-ink-writing: Scalable design and hierarchical printing
Peishi Yu, Lixin Qi, Zhiyang Guo, Shiyu Lin, Yu Liu, Junhua Zhao
Abstract
The online strain acquisition is highly desired for structural monitoring of key equipment such as aircrafts or high-speed trains. However, there are still enormous challenges to monitor full-field strain in large area with arbitrary shape, especially when the non-contact approaches are not applicable. In this study, we firstly develop an optimization design principle for arbitrary-shape-adaptable sensor array with scalable circuit layout, and then a hierarchical printing strategy by direct-ink-writing is proposed to enable simultaneous monitoring in large-scale area or multiple domains. According to the design principle and printing strategy, the proof-of-concept sensor arrays (e.g. with 8 × 8 and 4 × 16 grids) are designed and printed by bottom-up hierarchies from the layered components (e.g. wires, filaments and isolation intervals) to the main arrays through distributed printing sub-arrays (4 × 4 grids). In particular, the strain field surrounding a hole is monitored in high-precision based on the present strain sensor. This work also provides insights of sensor array from adaptive design to high-efficient DIW-fabrication for other applications including wearable electronics, small-batch equipment and individual medical devices.