Ni and Sb improve the microstructure, mechanical properties, and solder joint reliability of Sn-3.0Ag-0.5Cu alloy
Biao Wang, Jikang Yan, Jiangshan Liu, Jianhua Zhao, Lingyan Zhao
Topics & Concepts
MicrostructureSolderingJoint (building)AlloyReliability (semiconductor)Materials scienceMetallurgyStructural engineeringEngineeringQuantum mechanicsPhysicsPower (physics)Electronic Packaging and Soldering TechnologiesAluminum Alloy Microstructure PropertiesAdvanced Welding Techniques Analysis