Thermo-compression bonding process characteristics and shape control of Cu-pillar microbump joints by optimizing of solder melting

Mingang Fang, Chu Tang, Yiming Chen, Junhui Li, Zhuo Chen, Fuliang Wang, Wenhui Zhu

2022Journal of Materials Science Materials in Electronics13 citationsDOI

Topics & Concepts

Materials scienceSolderingComposite materialInterconnectionFlip chipSnagTemperature cyclingTinMetallurgyThermalLayer (electronics)PhysicsEcologyBiologyHabitatAdhesiveComputer scienceMeteorologyComputer networkElectronic Packaging and Soldering Technologies3D IC and TSV technologiesInjection Molding Process and Properties