Numerical investigation on Sn-rich solder joints failure mode: Effects of the thermomechanical anisotropic performance
Zhao Zhang, Kun Ma, Kang Liang, Fang Dong, Zhengfang Qian, Sheng Liu
Topics & Concepts
SolderingMaterials scienceJoint (building)Failure mode and effects analysisAnisotropyIsotropyConstitutive equationMode (computer interface)Composite materialThermal fatigueThermalStructural engineeringFinite element methodComputer scienceEngineeringThermodynamicsOpticsOperating systemPhysicsElectronic Packaging and Soldering TechnologiesAdvanced Welding Techniques AnalysisAluminum Alloys Composites Properties