Effect of thermal strain on the microstructure evolution and post-aging mechanical properties of Al-Zn-Mg-Cu alloy in simulating hot stamping process
Jue Lu, Yanli Song, Pu Zhou, Xu H, Yujian Liu, Lin Hua
Topics & Concepts
Materials scienceMicrostructureElectron backscatter diffractionNucleationPrecipitationDislocationDifferential scanning calorimetryAlloyMetallurgyTransmission electron microscopyUltimate tensile strengthGrain sizeComposite materialThermodynamicsMeteorologyNanotechnologyPhysicsAluminum Alloy Microstructure PropertiesMicrostructure and mechanical propertiesAluminum Alloys Composites Properties