CW laser-assisted splitting of SiC wafer based on modified layer by picosecond laser
Lu Jiang, Shusen Zhao, Shifei Han, Han Liang, Jiabao Du, Haijuan Yu, Xuechun Lin
Topics & Concepts
Materials scienceWaferPicosecondLaserLayer (electronics)OptoelectronicsOpticsNanotechnologyPhysicsLaser Material Processing TechniquesAdvanced Surface Polishing TechniquesIntegrated Circuits and Semiconductor Failure Analysis