Studies of Cu-Sn interdiffusion coefficients in Cu3Sn and Cu6Sn5 based on the growth kinetics
Yue Wang, Xianwen Peng, Jihua Huang, Zheng Ye, Jian Yang, Shuhai Chen
Topics & Concepts
Materials scienceDiffusionKinetic energyThermodynamicsKineticsWork (physics)Volume (thermodynamics)Phase (matter)Physical chemistryChemistryClassical mechanicsPhysicsOrganic chemistryElectronic Packaging and Soldering TechnologiesAluminum Alloy Microstructure PropertiesIntermetallics and Advanced Alloy Properties