Novel micro-nano epoxy composites for electronic packaging application: Balance of thermal conductivity and processability
Yang Hu, Chao Chen, Yingfeng Wen, Zhigang Xue, Xingping Zhou, Dean Shi, Guo‐Hua Hu, Xiaolin Xie
Topics & Concepts
Materials scienceComposite materialThermal conductivityEpoxyThermal expansionNano-Glass transitionPolymerThermal properties of materialsAdvanced Sensor and Energy Harvesting MaterialsDielectric materials and actuators