Preparation and characterization of ultra-thin dicing blades with different bonding properties
Zewei Yuan, Shuang Feng, Tianzheng Wu
Topics & Concepts
Wafer dicingAbrasiveMaterials scienceEnhanced Data Rates for GSM EvolutionBlade (archaeology)Mechanical engineeringGrindingComposite materialEngineering drawingComputer scienceEngineeringLayer (electronics)TelecommunicationsAdvanced Surface Polishing TechniquesAdhesion, Friction, and Surface InteractionsAdvanced machining processes and optimization