Novel interface regulation of Sn1.0Ag0.5Cu composite solders reinforced with modified ZrO2: Microstructure and mechanical properties
Fupeng Huo, Zhi Hao Jin, Duy Le Han, Jiahui Li, Keke Zhang, Hiroshi Nishikawa
Topics & Concepts
Materials scienceMicrostructureNon-blocking I/OComposite numberComposite materialUltimate tensile strengthDuctility (Earth science)MetallurgyCreepBiochemistryChemistryCatalysisAluminum Alloys Composites PropertiesElectronic Packaging and Soldering TechnologiesAdvanced Welding Techniques Analysis