Review on the various strategies adopted for the polishing of silicon wafer — A chemical perspective
Mayank Srivastava, Jasvinder Singh, Dipesh Kumar Mishra, Ravinder Pal Singh
Topics & Concepts
LappingWaferPolishingAbrasiveChemical-mechanical planarizationMicroelectronicsGrindingMaterials scienceMechanical engineeringEngineering physicsProcess engineeringNanotechnologyEngineeringMetallurgyAdvanced Surface Polishing TechniquesDiamond and Carbon-based Materials ResearchForce Microscopy Techniques and Applications