77GHz Cavity-Backed AiP Array in FOWLP Technology

Mei Sun, Lim Teck Guan, Chai Tai Chong

20222022 IEEE 72nd Electronic Components and Technology Conference (ECTC)12 citationsDOI

Abstract

This paper presents a 4×8 AiP array implemented in Fan-Out Wafer-Level-Packaging (FOWLP) technology for 77GHz high resolution compact multi-functional MIMO radar applications. It features a cavity-backed 3D stacked structure to achieve stable patterns and wide bandwidth. The fabricated sample with a size of 16mm×16mm×0.402mm shows a measured |S11| <-12.2dB, Gain >14dBi and stable patterns with boresight radiations over 77-81GHz.

Topics & Concepts

Wafer-level packagingBandwidth (computing)Electronic engineeringOptoelectronicsMaterials scienceWaferRadarComputer scienceOpticsEngineeringTelecommunicationsPhysicsRadio Frequency Integrated Circuit DesignMicrowave Engineering and WaveguidesAntenna Design and Optimization