Synthesis of coumarin derivatives as levelers for Through-Hole electroplating of copper in PCBs and a study on leveling mechanism of optimized leveler
Jingyu Xie, Xinpeng Yin, Fengyan Lu, Xuyang Li, Limin Wang
Topics & Concepts
ChemistryCopperMechanism (biology)ElectroplatingCoumarinCombinatorial chemistryChemical engineeringOrganic chemistryLayer (electronics)PhilosophyEngineeringEpistemologyElectrodeposition and Electroless CoatingsElectronic Packaging and Soldering TechnologiesCorrosion Behavior and Inhibition