Effects of initial Cu grain size and impurity residues on the liquid phase reactions between molten solder and electroplated Cu
Li‐Chi Huang, Jenn‐Ming Song, Chih‐Ming Chen
Topics & Concepts
Materials scienceElectroplatingSolderingImpurityMetallurgyCopperGrain sizeTexture (cosmology)Phase (matter)MicrostructureAlloyShear strength (soil)Scanning electron microscopeComposite materialLayer (electronics)Environmental scienceSoil waterOrganic chemistryChemistrySoil scienceComputer scienceImage (mathematics)Artificial intelligenceElectronic Packaging and Soldering Technologies3D IC and TSV technologiesElectrodeposition and Electroless Coatings