Thermal and mechanical design of tangential hybrid microchannel and high-conductivity inserts for cooling of disk-shaped electronic components
Reza Dadsetani, G. A. Sheikhzade, Marjan Goodarzi, A. Zeeshan, R. Ellahi, Mohammad Reza Safaei
Topics & Concepts
MicrochannelThermal conductivityMaterials scienceConductivityComposite materialvon Mises yield criterionStress (linguistics)Mechanical engineeringThermodynamicsNanotechnologyFinite element methodChemistryEngineeringPhysicsPhysical chemistryLinguisticsPhilosophyHeat Transfer and OptimizationHeat Transfer and Boiling StudiesHeat Transfer Mechanisms