Litcius/Paper detail

Micro shape optimization for minimizing microstructural thermal-stress considering heat conduction

Mihiro TORISAKI, Masatoshi SHIMODA, Musaddiq Al Ali

2024International Journal of Mechanical Sciences24 citationsDOI

Topics & Concepts

Materials scienceThermal conductionThermalComposite materialStress (linguistics)MechanicsStructural engineeringMechanical engineeringThermodynamicsEngineeringPhysicsPhilosophyLinguisticsTopology Optimization in EngineeringComposite Material MechanicsComposite Structure Analysis and Optimization