Direct metal bonding using nanotwinned Ag films with (1 1 1) surface orientation under air atmosphere for heterogeneous integration
Leh-Ping Chang, Jianjie Wang, Tzu‐Heng Hung, Kuan‐Neng Chen, Fan-Yi Ouyang
Topics & Concepts
Materials scienceDirect bondingBonding strengthAnodic bondingOxideAtmosphere (unit)Thermal diffusivityMetalComposite materialMetallurgyLayer (electronics)SiliconThermodynamicsPhysicsQuantum mechanics3D IC and TSV technologiesElectronic Packaging and Soldering TechnologiesCopper Interconnects and Reliability