Theoretical and experimental investigations on mechanical properties of (Fe,Ni)Sn2 intermetallic compounds formed in SnAgCu/Fe-Ni solder joints
Li‐Yin Gao, Yixiu Luo, Peng Wan, Zhi‐Quan Liu
Topics & Concepts
Materials scienceIntermetallicSolderingDuctility (Earth science)NanoindentationPhase (matter)Scanning electron microscopeModulusTinComposite materialMetallurgyCrystallographyAnalytical Chemistry (journal)CreepChemistryAlloyChromatographyOrganic chemistryElectronic Packaging and Soldering TechnologiesIntermetallics and Advanced Alloy PropertiesMetallurgical and Alloy Processes