Mechanism on preferred orientation roof-type Cu6Sn5 grain formation in micro-bump with (111) nanotwinned copper UBM
Yang Wu, Mingliang Huang, S.N. Zhang
Topics & Concepts
CopperMaterials scienceSolderingIntermetallicMetallurgyComposite materialAlloyElectronic Packaging and Soldering Technologies3D IC and TSV technologiesAdvanced Welding Techniques Analysis